According to IDTechEx, the Co-Packaged Optics (CPO) market is projected to exceed US$20 billion by 2036, growing at a robust CAGR of 37% from 2026 to 2036. CPO network switches are expected to dominate revenue generation, driven by each switch potentially incorporating up. That playbook is no longer holding for today's AI systems. As AI clusters push beyond 100 Tb/s per node, the gap between what silicon can generate and what traditional copper interconnects can deliver is widening fast. Three hurdles are now colliding: First, power delivery is nearing practical. Co-Packaged Optics (CPO) is an advanced optical interconnect architecture that integrates optical components—such as photonic integrated circuits (PICs) and lasers—directly alongside switching ASICs or processors within the same package. This approach significantly reduces electrical I/O distance. Co-Packaged Optics (CPO) Market (By Component: Optical engines/transceivers, Photonic integrated circuits, Lasers, Modulators, Electrical ICs / SerDes, Optical fibers and waveguides, Connectors and interfaces, Thermal management solutions, Packaging substrates and interposers, Testing and alignment. Yole Group unveils its latest photonic market and technology analyses, Silicon Photonics 2025 and Co-Packaged Optics for Data Centers 2025, which explore how AI-driven demand is reshaping connectivity, from transceivers to packaging innovation. But after nearly a decade of existence, where does this next-generation optical. Co-Packaged Optics Module (CPO) by Application (Ethernet Switches, Machine Learning, Other), by Types (100G, 400G, Other), by North America (United States, Canada, Mexico), by South America (Brazil, Argentina, Rest of South America), by Europe (United Kingdom, Germany, France, Italy, Spain, Russia.