Electronic Interconnect And Packaging Solutions

Browse technical resources about modular data centers, thermal management, PDU, 800G optics, liquid cooling, AI interconnects, and edge computing.

  • Mexico Data Center Solutions

    Mexico Data Center Solutions

    The México data center market is located in the region of Central America and within Latin America (LATAM). The most popular facilities are Telmex Cancun and. THEOS specializes in Managed Data Center Services, offering comprehensive solutions that include infrastructure management, application migration, and hybrid cloud integration. With a focus on advanced technologies and skilled personnel, the company effectively addresses the needs of complex. The data center market in Mexico is growing at a compound annual growth rate (CAGR) of 7. 07% (2024–2029), reaching a projected 480 MW in installed IT capacity by 2029. With a projected. Hewlett Packard Enterprise (HPE) and Ascenty are partners to drive your digital evolution. Learn more! Implement a secure hybrid cloud strategy with Microsoft Azure.


  • Practical Guide to Relay Protection Electronic Version

    Practical Guide to Relay Protection Electronic Version

    The objective of relay protection is to quickly isolate a faulty section from both ends so that the rest of the system can function satisfactorily. The functional requirements of the relay:.


  • Breakthrough in Silicon Photonics Interconnect Technology

    Breakthrough in Silicon Photonics Interconnect Technology

    Intel has achieved a breakthrough in the photonics segment, unveiling the world's first fully integrated optical compute interconnect for emerging AI markets. Silicon (Si) photonics is a groundbreaking technology that merges the fields of Si microelectronics and photonics to enable the manipulation and transmission of light on a Si chip. When we talk about the world of interconnects and how vital they have been for the AI markets, the prospects of photonics are discussed. On-chip interconnect today is based on copper/low-k wiring – in today's chips, there can be more than 100 km of copper wires. Newly-developed materials and processes allow. STMicroelectronics of Geneva, Switzerland says that it is helping hyperscalers, and the leading optical module provider, to overcome these challenges by unveiling its next generation of proprietary technologies for higher-performing optical interconnect in data centers and AI clusters. Revitalized interest in silicon photonics.

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