Marvell Announces Breakthrough Co Packaged Optics

Browse technical resources about modular data centers, thermal management, PDU, 800G optics, liquid cooling, AI interconnects, and edge computing.

  • Breakthrough in Silicon Photonics Interconnect Technology

    Breakthrough in Silicon Photonics Interconnect Technology

    Intel has achieved a breakthrough in the photonics segment, unveiling the world's first fully integrated optical compute interconnect for emerging AI markets. Silicon (Si) photonics is a groundbreaking technology that merges the fields of Si microelectronics and photonics to enable the manipulation and transmission of light on a Si chip. When we talk about the world of interconnects and how vital they have been for the AI markets, the prospects of photonics are discussed. On-chip interconnect today is based on copper/low-k wiring – in today's chips, there can be more than 100 km of copper wires. Newly-developed materials and processes allow. STMicroelectronics of Geneva, Switzerland says that it is helping hyperscalers, and the leading optical module provider, to overcome these challenges by unveiling its next generation of proprietary technologies for higher-performing optical interconnect in data centers and AI clusters. Revitalized interest in silicon photonics.

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  • Liechtenstein Co-packaged Optics 2 5G

    Liechtenstein Co-packaged Optics 2 5G

    Co-packaged optics is an up-and-coming technology that addresses these challenges created by small form factor pluggable optical transceivers. With it, you can bring optics as close as possible to the s.


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